Method for regenerating silicon dioxide from semiconductor waste packaging material capable of obtaining more than 99% high-purity silica powders

• Main Authors: ZHOU, XIN-HUI, ZHANG, PEI-LING, XIE, XING-WEN, XIE, YA-MIN
• Format: Patent
• Language: Chinese; English
• Published: 01.05.2022
• Subjects: CHEMISTRY; COMPOUNDS THEREOF; DISPOSAL OF SOLID WASTE; INORGANIC CHEMISTRY; MAKING GRANULES OR PREFORMS; METALLURGY; NON-METALLIC ELEMENTS; PERFORMING OPERATIONS; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED; RECLAMATION OF CONTAMINED SOIL SOIL; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The present invention provides a method for regenerating silicon dioxide from semiconductor waste packaging materials. The method includes crushing the waste packaging materials; placing crushed waste packaging materials on a carrier plate in an oven for cracking processing so that defects or cracks of thermosetting resins are generated, or cracks or separations of interfaces between thermosetting resins and silica powders are formed; placing cracked waste packaging materials in a heating decomposition tank for decomposition with a decomposition solution; filter pressing the decomposed waste packaging materials and the decomposition solution with a first filter press to obtain a silica filter cake; stirring and rinsing the silica filter cake with pure water in a cleaning tank; filter pressing the rinsed silica with a second filter press to obtain white silica filter cake; drying the obtained white silica filter cake; and crushing and classifying the dried white silica filter cake to obtain more than 99% high-