Negative photosensitive resin composition, pattern formation method, and laminated film

A negative photosensitive resin composition that contains an epoxy-group-containing resin and a cationic polymerization initiator and includes a sulfonium salt indicated by general formula (10). In the formula (10), R1 and R2 indicate an aryl group, a heterocyclic hydrocarbon group, or an alkyl grou...

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Main Authors NAKAMURA, YUJI, SHIBAGAKI, TOMOYUKI, YAMAGATA, KENICHI, NAKAO, TAKUTO, MASUJIMA, MASAHIRO, IMAI, HIROFUMI, KONDO, TAKAHIRO
Format Patent
LanguageChinese
English
Published 16.04.2022
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Summary:A negative photosensitive resin composition that contains an epoxy-group-containing resin and a cationic polymerization initiator and includes a sulfonium salt indicated by general formula (10). In the formula (10), R1 and R2 indicate an aryl group, a heterocyclic hydrocarbon group, or an alkyl group. R3-R5 are an alkyl group, a hydroxy group, an alkoxy group, an alkyl carbonyl group, an aryl carbonyl group, an asiloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, a hydroxy (poly) alkyleneoxy group, or a halogen atom. k is an integer 0-4, m is an integer 0-3, and n is an integer 1-4. A is a group indicated by -S-, -O-, -SO-, -SO2-, or -CO-. X- is a monovalent polyatomic atom.
Bibliography:Application Number: TW202110120617