Method for manufacturing substrate with built-in components, and substrate with built-in components

• Main Authors: MURAI, HIKARI, AKAI, KUNIHIKO, IZAWA, HIROYUKI, TAKANO, NOZOMU, ITOU, YUKA, OKOSHI, MASASHI
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

This method for manufacturing a substrate with built-in components comprises: a step for providing an intermediate member 2 having an electronic component 10 with a first electrode 11 provided on a first surface 13 thereof, and a first electrically conductive layer 20 provided on the first surface 13 of the electronic component 10 so as to cover the first electrode 11; and a step for forming a first insulating resin layer 40 on the first surface 3 of the intermediate member 2. The first electrically conductive layer 20 comprises: a first curable adhesive layer 23 composed of a curable adhesive layer 22 including electrically conductive particles 21 and a cured adhesive composition; and a first metal foil layer 24 disposed on a surface of the first curable adhesive layer 23 on the side opposite the electronic component 10. The electrically conductive particles 21 of the first curable adhesive layer 23 electrically connect the first electrode 11 of the electronic component 10 with the first metal foil layer 24.