Embedded packaging structure having shielding cavity and manufacturing method thereof

An embedded package structure having a shielding cavity according to an embodiment of the present disclosure includes a device embedded in an insulating layer, and a shielding cavity enclosing the device, wherein the shielding cavity is defined by a shielding wall embedded in the insulating layer an...

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Bibliographic Details
Main Authors FENG, LEI, HUANG, BEN-XIA, JIANG, LI-NA, GU, MIN, CHEN, XIAN-MING, WANG, WEN-SHI
Format Patent
LanguageChinese
English
Published 01.04.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An embedded package structure having a shielding cavity according to an embodiment of the present disclosure includes a device embedded in an insulating layer, and a shielding cavity enclosing the device, wherein the shielding cavity is defined by a shielding wall embedded in the insulating layer and surrounding the device on four sides, and first and second wiring layers which cover first and second end faces of the shielding wall and are electrically connected with the shielding wall; wherein a signal line leading-out opening is to formed between the first end face of the shielding wall and the first wiring layer, and a signal line connected with a terminal of the device is led, from the signal line leading-out opening, out of the shielding cavity.
Bibliography:Application Number: TW202110129009