Semiconductor device and method for manufacturing same

A semiconductor device manufacturing method according to the present disclosure comprises: (A) a step for arranging a first chip on a substrate; (B) a step for arranging a plurality of elevating sections on the substrate around the first chip or around a region in which the first chip is to be arran...

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Main Authors NAKAMURA, KANAMI, TANIGUCHI, KOHEI, OZAKI, YOSHINOBU, HASHIMOTO, HIROKI, ITAGAKI, KEI, YAMAMOTO, KAZUHIRO
Format Patent
LanguageChinese
English
Published 01.04.2022
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:A semiconductor device manufacturing method according to the present disclosure comprises: (A) a step for arranging a first chip on a substrate; (B) a step for arranging a plurality of elevating sections on the substrate around the first chip or around a region in which the first chip is to be arranged; (C) a step for preparing an adhesive section-attached chip including a second chip and an adhesive section provided on one surface of the second chip; (D) and a step for applying a pressing force to the adhesive section-attached chip toward the substrate so that the first chip and at least a part of the elevating sections are embedded in the adhesive section.
Bibliography:Application Number: TW202110129245