Semiconductor device and method for manufacturing same
A semiconductor device manufacturing method according to the present disclosure comprises: (A) a step for arranging a first chip on a substrate; (B) a step for arranging a plurality of elevating sections on the substrate around the first chip or around a region in which the first chip is to be arran...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.04.2022
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor device manufacturing method according to the present disclosure comprises: (A) a step for arranging a first chip on a substrate; (B) a step for arranging a plurality of elevating sections on the substrate around the first chip or around a region in which the first chip is to be arranged; (C) a step for preparing an adhesive section-attached chip including a second chip and an adhesive section provided on one surface of the second chip; (D) and a step for applying a pressing force to the adhesive section-attached chip toward the substrate so that the first chip and at least a part of the elevating sections are embedded in the adhesive section. |
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Bibliography: | Application Number: TW202110129245 |