Manufacturing method of micro LED modules for realizing integral packaging of micro LED dies on a polyimide film to avoid flexure

• Main Authors: LIU, YU-WEN, CHEN, CHUNG-YI, CHEN, WENIN, LO, CHI-HUAN
• Format: Patent
• Language: Chinese; English
• Published: 16.03.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided is a manufacturing method of micro LED modules, which includes the following steps: providing a composite film with a thermally induced viscosity-reducing pressure-sensitive adhesive, which at least includes a thermally induced viscosity-reducing pressure-sensitive adhesive and a pressure-sensitive adhesive, wherein the adhesion of the thermally induced viscosity-reducing pressure-sensitive adhesive that has been heated and then cooled is less than its initial adhesion; adhering the thermally induced viscosity-reducing pressure-sensitive adhesive of the composite film to a polyimide film with a circuit width less than 30 microns, and adhering the pressure-sensitive adhesive of the composite film to a carrier board; providing a plurality of micro LED dies, which are electrically connected and assembled onto the micro circuit of the polyimide film; providing a transparent packaging material to cover the plurality of micro LED dies; after performing a heating process and then cooling, de-adhering the th