Cutting device and manufacturing method of cut product capable of calculating and obtaining the specified position of at least a portion of the main shaft unit

An object of the present invention is to provide a cutting device or the like capable of calculating the height position of at least a portion of a main shaft unit regardless of the position of the main shaft unit in the horizontal direction. To achieve the object, the cutting device of the present...

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Bibliographic Details
Main Authors IMAI, ICHIRO, IGUCHI, HARUKI, KATAOKA, SHOICHI
Format Patent
LanguageChinese
English
Published 01.03.2022
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:An object of the present invention is to provide a cutting device or the like capable of calculating the height position of at least a portion of a main shaft unit regardless of the position of the main shaft unit in the horizontal direction. To achieve the object, the cutting device of the present invention includes a main shaft unit, a moving unit, and a detector. The main shaft unit includes a blade for cutting a work-piece. The moving unit is configured to hold the main shaft unit and move the main shaft unit in the horizontal direction. The detector includes a light-emitting part and a light-receiving part that receives light emitted by the light-emitting part, and is mounted on the moving unit. The detector is configured to detect that at least a portion of the main shaft unit blocks the light.
Bibliography:Application Number: TW202110130635