Blended contact fingers for preventing cracks during thin substrate handling

A contact for providing a connection to a substrate in a substrate plating system includes a body having an arcuate shape. The arcuate shape of the body is configured to conform to a shape of at least a portion of a substrate arranged on a lip seal and a cup of the substrate plating system. A plural...

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Bibliographic Details
Main Authors BANIK, STEPHEN J, OSTROWSKI, JOHN FLOYD, KUMAR, SANTOSH, BUCKALEW, BRYAN, RASH, ROBERT, GOH, MENG WEE EDWIN, WILMOT, FREDERICK DEAN
Format Patent
LanguageChinese
English
Published 01.03.2022
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Summary:A contact for providing a connection to a substrate in a substrate plating system includes a body having an arcuate shape. The arcuate shape of the body is configured to conform to a shape of at least a portion of a substrate arranged on a lip seal and a cup of the substrate plating system. A plurality of first contact fingers extend a first distance from the body. A plurality of second contact fingers extend a second distance from the body. The first distance is greater than the second distance.
Bibliography:Application Number: TW202110115709