Circuit substrate and method for manufacturing the same

• Main Authors: WANG, CHEN-HAO, TONG, GUANNG, CHEN, HSUEH-YU
• Format: Patent
• Language: Chinese; English
• Published: 01.01.2022
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The present disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a conductive wire and a base substrate having a base region and a circuit region. The base region is constituted of a first thermoplastic material and has a first pattern. The circuit region is constituted of a second thermoplastic material and has a second pattern. The first pattern has a portion opposite to the second pattern. The conductive wire is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle.