Chip-detecting method, chip-detecting structure and chip-carrying structure

A chip-detecting method, a chip-detecting structure and a chip-carrying structure are provided. The chip-detecting method includes providing a chip-detecting structure, a chip-carrying structure and a plurality of welding material groups, the chip-detecting structure including a plurality of micro h...

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Bibliographic Details
Main Authors CHANG, CHENGIEH, LIAO, CHIEN-SHOU
Format Patent
LanguageChinese
English
Published 16.12.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:A chip-detecting method, a chip-detecting structure and a chip-carrying structure are provided. The chip-detecting method includes providing a chip-detecting structure, a chip-carrying structure and a plurality of welding material groups, the chip-detecting structure including a plurality of micro heater groups, the chip-carrying structure being used for carrying a plurality of chips, and the welding material groups being disposed between the chip-carrying structure and the chip-detecting structure; placing the chip-carrying structure and the chip-detecting structure adjacent to each other, so that each of the welding material groups synchronously contact the chip-carrying structure and the chip-detecting structure, and each of the welding material groups including a low temperature welding material group and a high temperature welding material group that has a melting point higher than a melting point of the low temperature welding material group; respectively curing the low temperature welding material grou
Bibliography:Application Number: TW202110118356