Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrate
The disclosure relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrate, an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate and a method for a chemical and/or electrolytic su...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
16.12.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The disclosure relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrate, an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate and a method for a chemical and/or electrolytic surface treatment of a substrate in a process fluid. The distribution system comprises a distribution body. The distribution body comprises a plurality of openings for the process fluid. The openings are arranged in a spiral-shaped pattern on a surface of the distribution body. |
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Bibliography: | Application Number: TW202110116872 |