Platen, assembly for holding workpiece, and electrostatic chuck
A platen having improved thermal conductivity and reduced friction, an assembly for holding a workpiece, and an electrostatic chuck are disclosed. In one embodiment, vertically aligned carbon nanotubes are grown on the top surface of the platen. The carbon nanotubes have excellent thermal conductivi...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.11.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A platen having improved thermal conductivity and reduced friction, an assembly for holding a workpiece, and an electrostatic chuck are disclosed. In one embodiment, vertically aligned carbon nanotubes are grown on the top surface of the platen. The carbon nanotubes have excellent thermal conductivity, thus improving the transfer of heat between the platen and the workpiece. Furthermore, the friction between the carbon nanotubes and the workpiece is much lower than that with conventional embossments, reducing particle generation. In another embodiment, a support plate is disposed on the platen, wherein the carbon nanotubes are disposed on the top surface of the support plate. |
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Bibliography: | Application Number: TW202110100193 |