Carrier film for semiconductor wafer processing

A carrier film includes an adhesive layer, a core layer, and a release layer. The adhesive layer includes a hydrogenated styrene block copolymer having a storage modulus (G') of less than or equal to 400 kPa at 25 DEG C, and a first polyolefin elastomer. The core layer includes a second polyole...

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Bibliographic Details
Main Authors BRADY, KEVIN A, RAY, CARL DOUGLAS, SSUBRAMANIAM, SURYA
Format Patent
LanguageChinese
English
Published 01.11.2021
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
SEMICONDUCTOR DEVICES
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Summary:A carrier film includes an adhesive layer, a core layer, and a release layer. The adhesive layer includes a hydrogenated styrene block copolymer having a storage modulus (G') of less than or equal to 400 kPa at 25 DEG C, and a first polyolefin elastomer. The core layer includes a second polyolefin elastomer, and the release layer includes a polyolefin.
Bibliography:Application Number: TW202110107897