Device and method for removing a framed wafer from a wafer tray

• Main Authors: AMMERL, JOSEF, FROESCHL, MICHAEL
• Format: Patent
• Language: Chinese; English
• Published: 16.10.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HAND TOOLS; MANIPULATORS; PERFORMING OPERATIONS; PORTABLE POWER-DRIVEN TOOLS; SEMICONDUCTOR DEVICES; TRANSPORTING

A device for removing a framed wafer from a wafer tray is proposed, said wafer tray including an access for depositing or removing the framed wafer, wherein the deposited framed wafer has a front frame edge facing the access and the wafer tray includes at least one wafer tray edge contact element for abutting against the rear frame edge, comprising a wafer receptacle for receiving the framed wafer, the wafer receptacle being configured to hold the wafer perpendicular to the wafer plane and to remove it from the wafer tray in this manner and including at least one wafer receptacle edge contact element arranged and configured to abut against the front frame edge, and with a drive and control device configured to guide the wafer receptacle along a predetermined path of movement into the access to the wafer tray and out of it, wherein each wafer receptacle edge contact element is spring-mounted in the direction of the path of movement and the wafer receptacle is movable from a first position, in which each wa-fer