Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board

• Main Authors: FUJISAWA, HIROYUKI, SHINPO, TAKASHI, YAMADA, YUJI, YAMADA, TAKAHIRO, OTSUKA, AKIRA
• Format: Patent
• Language: Chinese; English
• Published: 16.10.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound (A), a maleimide compound (B), a curing agent (C), a metal phosphinate flame retardant (D), an inorganic filler (E) surface-treated with a hydrophobic silane coupling agent, and an inorganic filler (F) surface-treated with a hydrophilic silane coupling agent, the inorganic filler (E) content being in a ratio of 20-80% by mass with respect to the total quantity of the inorganic filler (E) and the inorganic filler (F).