Glass and melt solder for the passivation of semiconductor components

The invention relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.

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Bibliographic Details
Main Authors PICHLER-WILHELM, SABINE, LETZ, MARTIN, HOVHANNISYAN, MARTUN, BARTELT, LINDA JOHANNA, GOLD, JULIA, TRIZZINO, ANTONIO
Format Patent
LanguageChinese
English
Published 01.10.2021
Subjects
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS
CHEMISTRY
GLASS
JOINING GLASS TO GLASS OR OTHER MATERIALS
METALLURGY
MINERAL OR SLAG WOOL
SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS
SURFACE TREATMENT OF GLASS
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Summary:The invention relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.
Bibliography:Application Number: TW202110108241