Adhesive composition, adhesive sheet, laminate, and printed wiring board

To provide an adhesive composition which has a high adhesion to a metal substrate and a resin substrate such as a liquid crystal polymer or syndiotactic polystyrene as well as to a conventional polyimide or polyester film, and also has excellent low dielectric characteristics and pot life, and from...

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Bibliographic Details
Main Authors SONODA, RYO, KAWAKUSU, TETSUO
Format Patent
LanguageChinese
English
Published 16.08.2021
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
PRINTED CIRCUITS
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Summary:To provide an adhesive composition which has a high adhesion to a metal substrate and a resin substrate such as a liquid crystal polymer or syndiotactic polystyrene as well as to a conventional polyimide or polyester film, and also has excellent low dielectric characteristics and pot life, and from which high solder heat resistance can be achieved. This adhesive composition contains (a) an acid-modified polyolefin, (b) a phenol resin having a polycyclic structure, and (c) an epoxy resin.
Bibliography:Application Number: TW20209141235