Optical semiconductor device and method for manufacturing same

The present invention comprises a mounting member (22) which has a diffusion bonding layer (23b) formed on the front surface, an optical semiconductor element (21) which has a light emitting part (21b) and a diffusion bonding layer (23a) which is formed on the rear surface, and an electrode layer (2...

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Bibliographic Details
Main Author NEGISHI, MASATO
Format Patent
LanguageChinese
English
Published 01.08.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention comprises a mounting member (22) which has a diffusion bonding layer (23b) formed on the front surface, an optical semiconductor element (21) which has a light emitting part (21b) and a diffusion bonding layer (23a) which is formed on the rear surface, and an electrode layer (23) formed by diffusion bonding of diffusion bonding layer (23b) and diffusion bonding layer (23a), the light emitting part (21b) being provided more toward the mounting member (22) on the side surface of the optical semiconductor element (21). As a result, the use of solder and Ag paste or the like is not required, preventing contamination of the light emitting part of the optical semiconductor element by solder, and heat dissipation properties are improved by the light emitting part being brought even closer to the mounting member.
Bibliography:Application Number: TW20209127338