Wafer conveyance unit and wafer conveyance method
This failure analysis unit is a wafer conveyance unit that holds a wafer while conveying the wafer in a semiconductor failure analysis device, wherein: the wafer conveyance unit comprises a mounting stand that secures a wafer at a prescribed observation position, and a wafer chuck that conveys the w...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
01.08.2021
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Subjects | |
Online Access | Get full text |
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Summary: | This failure analysis unit is a wafer conveyance unit that holds a wafer while conveying the wafer in a semiconductor failure analysis device, wherein: the wafer conveyance unit comprises a mounting stand that secures a wafer at a prescribed observation position, and a wafer chuck that conveys the wafer, while holding the wafer, to the observation position; and the wafer chuck comprises a plurality of holding members (protruding sections) disposed so as to face the side surface of the wafer, and the wafer is held through the gripping of the periphery of the wafer W by the plurality of holding members. |
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Bibliography: | Application Number: TW20209141698 |