Optical module manufacturing method

An optical module manufacturing method includes: attaching a light emitting device and a sensor on a substrate; disposing a first encapsulation portion and a second encapsulation portion on the light emitting device and the sensor, respectively; disposing a shielding layer on thereof; removing the f...

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Bibliographic Details
Main Authors LIM, SIN-HENG, XU, GUO-JUN, LEE, KUN-LUNG, GOH, TECKAI, NIJAGUNA, SURESH BASOOR, LIN, YUOU
Format Patent
LanguageChinese
English
Published 16.06.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An optical module manufacturing method includes: attaching a light emitting device and a sensor on a substrate; disposing a first encapsulation portion and a second encapsulation portion on the light emitting device and the sensor, respectively; disposing a shielding layer on thereof; removing the first encapsulation portion, the second encapsulation portion, and the shielding layer in a direction, and exposing a surface of the first encapsulation portion corresponding to the position of the light emitting device and a surface of the second encapsulation portion corresponds to the position of the sensor on the shielding layer.
Bibliography:Application Number: TW20198143910