Semiconductor substrate supports with improved high temperature chucking

Exemplary support assemblies may include an electrostatic chuck body defining a substrate support surface. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include a heater embedded within the electrostatic chuck body. The assemblies may also in...

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Bibliographic Details
Main Authors ROCHA-ALVAREZ, JUAN CARLOS, SRIVASTAVA, SHAILENDRA, HAN, XINHAI, PADHI, DEENESH, BENJAMIN RAJ, DAEMIAN RAJ, LI, JIAN, YE, ZHENG JOHN, WANG, CHUAN-YING, HU, KE-SONG
Format Patent
LanguageChinese
English
Published 16.06.2021
Subjects
BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
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Summary:Exemplary support assemblies may include an electrostatic chuck body defining a substrate support surface. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include a heater embedded within the electrostatic chuck body. The assemblies may also include an electrode embedded within the electrostatic chuck body between the heater and the substrate support surface. The substrate support assemblies may be characterized by a leakage current through the electrostatic chuck body of less than or about 4 mA at a temperature of greater than or about 500 DEG C and a voltage of greater than or about 600 V.
Bibliography:Application Number: TW20209125560