Surface-treated copper foil, copper-clad laminate plate, and printed wiring board

A surface-treated copper foil that has fine wiring processing properties and exceptional adhesion to a resin substrate is provided. A surface-treated copper foil having, on one surface thereof, a roughened surface formed through a roughening process, wherein the minimum autocorrelation length Sal of...

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Bibliographic Details
Main Authors TAKAZAWA, RYOJI, SATO, AKIRA, NAKASAKI, RYUSUKE
Format Patent
LanguageChinese
English
Published 16.06.2021
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Summary:A surface-treated copper foil that has fine wiring processing properties and exceptional adhesion to a resin substrate is provided. A surface-treated copper foil having, on one surface thereof, a roughened surface formed through a roughening process, wherein the minimum autocorrelation length Sal of the roughened surface is 1.0-8.5 [mu]m inclusive, and the root mean square height Sq is 0.10-0.98 [mu]m inclusive.
Bibliography:Application Number: TW20209118894