Surface-treated copper foil, copper-clad laminate plate, and printed wiring board

A surface-treated copper foil that has fine wiring processing properties and exceptional adhesion to a resin substrate is provided. A surface-treated copper foil having, on one surface thereof, a roughened surface formed through a roughening process, wherein the minimum autocorrelation length Sal of...

Full description

Saved in:
Bibliographic Details
Main Authors TAKAZAWA, RYOJI, SATO, AKIRA, NAKASAKI, RYUSUKE
Format Patent
LanguageChinese
English
Published 16.06.2021
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online AccessGet full text

Cover

More Information
Summary:A surface-treated copper foil that has fine wiring processing properties and exceptional adhesion to a resin substrate is provided. A surface-treated copper foil having, on one surface thereof, a roughened surface formed through a roughening process, wherein the minimum autocorrelation length Sal of the roughened surface is 1.0-8.5 [mu]m inclusive, and the root mean square height Sq is 0.10-0.98 [mu]m inclusive.
Bibliography:Application Number: TW20209118894