Substrate transferring device and substrate processing method using the same minimizing the thermal deformation of the substrate between the substrate and the heating part inside the chamber

• Main Authors: HUR, DONG-GEUN, CHOI, WOO-JIN, HEO, SUNG-IL, OH, JOON-HO, SON, HYUK-JOO, PARK, YOUNG-SOO, LEE, MIN-YOUNG
• Format: Patent
• Language: Chinese; English
• Published: 16.05.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a substrate transferring device and a substrate processing method using the same. Its purpose is to block between the substrate and the heating part inside the chamber to minimize the thermal deformation of the substrate during loading and unloading of the substrate. In order to achieve the substrate transferring device of this invention, the invention includes: a robot body equipped with a driving part that generates power; a transferring unit that supports and transfers the substrate; a transfer unit robot arm configured to be fastened to the robot body on one side and connected to the transferring unit on the other side, and transfer the transferring unit according to the driving of the driving part, so as to load the substrate into a chamber for processing the substrate or unload the substrate from the chamber; and a blocking unit configured to block between the heating part that heats the substrate inside the chamber and the substrate to block heat transfer when the substrate is