Substrate processing apparatus

A substrate processing apparatus includes a process chamber, an upper electrode disposed in an upper portion inside the process chamber and disposed to be spaced apart from an upper surface of the process chamber, a lower electrode disposed to oppose the upper electrode at a constant distance from t...

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Bibliographic Details
Main Authors JEON, BU-IL, PARK, JONG-IN
Format Patent
LanguageChinese
English
Published 16.04.2021
Subjects
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Summary:A substrate processing apparatus includes a process chamber, an upper electrode disposed in an upper portion inside the process chamber and disposed to be spaced apart from an upper surface of the process chamber, a lower electrode disposed to oppose the upper electrode at a constant distance from the upper electrode, a substrate seating means, electrically grounded and disposed to face the lower electrode at a constant distance from the lower electrode, in which a substrate is mounted, and a variable capacitor connected between the lower electrode and a ground or between the lower electrode and an output terminal of an RF power supply.
Bibliography:Application Number: TW20209134753