Electrostatic chuck

• Main Authors: ITAKURA, IKUO, SHIRAISHI, JUN, SATO, MASAKI, MOMIYAMA, YUTAKA, KOBAYASHI, KOUTA, SAIGAN, SHUICHIRO
• Format: Patent
• Language: Chinese; English
• Published: 16.03.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

This electrostatic chuck is provided with: a first electrostatic chuck part provided with an electrically conductive base plate that has a first portion and a second portion provided to the outer periphery of the first portion and that has provided thereto a gas introduction path to which a cooling gas is introduced, a ceramic dielectric substrate that is provided on the first portion, that is configured to be able to attract a wafer, and that has at least one through hole connected to the gas introduction path, and a first attraction electrode embedded in the ceramic dielectric substrate; and a second electrostatic chuck part that is provided on the second portion, that is configured to be able to attract a focus ring, and that is provided with a ceramic layer having at least one through hole through which the cooling gas can be introduced. The ceramic layer has at least a first layer that comes into contact with the focus ring when the second electrostatic chuck part attracts the focus ring. The first layer