Mounting of semiconductor-on-diamond wafers for device processing

The present invention discloses a semiconductor-on-diamond-on-carrier substrate wafer (55). The semiconductor-on-diamond-on-carrier wafer (55) comprises: a semiconductor-on-diamond wafer (40) having a diamond side and semiconductor side; a carrier substrate (50) disposed on the diamond side of the s...

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Bibliographic Details
Main Authors LOWE, FRANK YANTIS, FRANCIS, DANIEL, PEARSON, MICHAEL IAN
Format Patent
LanguageChinese
English
Published 16.03.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention discloses a semiconductor-on-diamond-on-carrier substrate wafer (55). The semiconductor-on-diamond-on-carrier wafer (55) comprises: a semiconductor-on-diamond wafer (40) having a diamond side and semiconductor side; a carrier substrate (50) disposed on the diamond side of the semiconductor-on-diamond wafer (40) and including at least one layer having a lower coefficient of thermal expansion (CTE) than diamond; and an adhesive layer (48) disposed between the diamond side of the semiconductor-on-diamond wafer (40) and the carrier substrate (50) to bond the carrier substrate (50) to the semiconductor-on-diamond wafer (40). The semiconductor-on-diamond-on-carrier substrate wafer (55) has the following characteristics: a total thickness variation of no more than 40 [mu]m; a wafer bow of no more than 100 [mu]m; and a wafer warp of no more than 40 [mu]m.
Bibliography:Application Number: TW20209131007