High density, controlled integrated circuits factory

A high density, controlled integrated circuits factory having process modules occupying approximately two-thirds of the factory floor space with the remaining one-third of the factory floor space being used for servicing the process modules and for loading and unloading wafers to and from the proces...

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Bibliographic Details
Main Authors KRISTOFFERSEN, CANDI, LILL, THORSTEN, GREGOR, MARIUSCH
Format Patent
LanguageChinese
English
Published 16.02.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A high density, controlled integrated circuits factory having process modules occupying approximately two-thirds of the factory floor space with the remaining one-third of the factory floor space being used for servicing the process modules and for loading and unloading wafers to and from the process modules. A subfloor is provided below the factory floor to allow service lifts to travel across the factory. Service lifts can be raised to the factory floor level to service process modules. Overhead lines are also provided over the process modules to transport service items as well as wafers across the factory.
Bibliography:Application Number: TW20209112989