An alignment device for semiconductor wafer inspection
The device of the invention is mainly to resolve the angle deviation problem during the inspection of the wafer. Through the present invention, it can greatly improve the efficiency of wafer inspection.
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.02.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The device of the invention is mainly to resolve the angle deviation problem during the inspection of the wafer. Through the present invention, it can greatly improve the efficiency of wafer inspection. |
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Bibliography: | Application Number: TW20198127450 |