Patterned wafer solder diffusion barrier

• Main Author: DUVAL, PAUL J
• Format: Patent
• Language: Chinese; English
• Published: 01.02.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Methods and apparatus for an integrated circuit having with a frontside metal layer on the frontside of the substrate and a backside metal layer on the backside of the substrate. The backside metal layer is deposited onto the backside of the substrate and into the via such that a portion of the back...