Semiconductor manufacturing device and method

• Main Authors: OKAMOTO, NAOKI, KURIHARA, YOSHIHIRO, NAKUI, YUKI, SAITO, AKIRA, IKARASHI, ITSUKI
• Format: Patent
• Language: Chinese; English
• Published: 16.01.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention provides a semiconductor manufacturing device and method capable of controlling a pushing unit with an optimal timing from the perspective of low pressure performance or high-speed pick-up performance of a bare chip. The semiconductor manufacturing device includes: a pushing unit that pushes a bare chip from below a dicing tape and has a plurality of blocks in contact with the dicing tape; a collet chuck, which adsorbs the bare chip; and a control unit, which is configured that for a peeling mode that reappears the characteristics of the pushing unit, feedback control is performed so that the output of the peeling model follows the target value of bending stress of the entire bare chip and peeling amount of the bare chip from the dicing tape, and the pushing amount, which is control input to the peeling model, becomes the pushing amount of the blocks by pushing means.