Epoxy curing compound and epoxy resin composition

• Main Authors: IKESHITA, SHINJI, NAKA, KENSUKE, MATSUKAWA, KIMIHIRO, KAWASAKI, NORIAKI, TAKETSUNA, HIROTAKA
• Format: Patent
• Language: Chinese; English
• Published: 16.01.2021
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; HETEROCYCLIC COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide an epoxy curing compound that makes it possible to obtain an epoxy resin composition having high heat resistance, flexibility, water resistance, and transparency. An epoxy curing compound characterized by being represented by general formula (1) or general formula (2). (In general formula (1), A is an optionally substituted C2-50 linear or branched hydrocarbon group optionally having a functional group that contains a hetero atom in the main chain and/or a side chain. A and S are connected without the intervention of an atom. a represents an integer of 2-6.) (In general formula (2), Rs is a hydrogen or a methyl group. R has a C2-28 linear or branched or cyclic structure optionally having a functional group that contains a hetero atom. R' represents at least one selected from hydrogen atoms, C1-8 alkyl groups, thiol groups, and functional groups represented by general formula (5). b is an integer, including 0, and c is an integer from 1 to 6, such that b + c = 2-6.) In general formulas (1) and (2),