Micromechanical sound transducer

• Main Authors: KAISER, BERT, EHRIG, LUTZ
• Format: Patent
• Language: Chinese; English
• Published: 16.01.2021
• Subjects: DEAF-AID SETS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PUBLIC ADDRESS SYSTEMS; TRANSPORTING

Micromechanical sound transducer comprising a plurality of unilaterally suspended bending transducers. The plurality of bending transducers are configured for deflection within a plane of vibration and are arranged side by side within the plane of vibration along a first axis. The plurality of bending transducers extends along a second axis which is transverse to the first axis. The bending transducers are alternately suspended on opposite sides and engage with one another. Each bending transducer comprises a first electrode and a second electrode which are located opposite one another along the first axis to cause deflections of the respective bending transducer along the first axis upon application of voltage. Mutually facing electrodes of adjacent bending transducers are electrically connected to one another by a transverse connection crossing the plane of vibration transverse to the first axis, so that for first bending transducers suspended on a first side of the opposite sides, the electrodes facing a f