Substrate patch reconstitution options

• Main Authors: JEN, WEI-LUN KANE, HARIRI, HAIFA, SALAMA, ISLAM A, ALUR, AMRUTHAVALLI PALLAVI
• Format: Patent
• Language: Chinese; English
• Published: 01.01.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments include semiconductor packages. A semiconductor package includes a first patch and a second patch on an interposer. The semiconductor package also includes a first substrate in the first patch, and a second substrate in the second patch. The semiconductor package further includes an encapsulation layer over and around the first and second patches, a plurality of build-up layers on the first patch, the second patch, and the encapsulation layer, and a plurality of dies and a bridge on the build-up layers. The bridge may be communicatively coupled with the first substrate of the first patch and the second substrate of the second patch. The bridge may be an embedded multi-die interconnect bridge (EMIB). The first and second substrates may be EMIBs and/or high-density packaging (HDP) substrates. The bridge may be positioned between two dies, and over an edge of the first patch and an edge of the second patch.