Substrate patch reconstitution options

Embodiments include semiconductor packages. A semiconductor package includes a first patch and a second patch on an interposer. The semiconductor package also includes a first substrate in the first patch, and a second substrate in the second patch. The semiconductor package further includes an enca...

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Bibliographic Details
Main Authors JEN, WEI-LUN KANE, HARIRI, HAIFA, SALAMA, ISLAM A, ALUR, AMRUTHAVALLI PALLAVI
Format Patent
LanguageChinese
English
Published 01.01.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments include semiconductor packages. A semiconductor package includes a first patch and a second patch on an interposer. The semiconductor package also includes a first substrate in the first patch, and a second substrate in the second patch. The semiconductor package further includes an encapsulation layer over and around the first and second patches, a plurality of build-up layers on the first patch, the second patch, and the encapsulation layer, and a plurality of dies and a bridge on the build-up layers. The bridge may be communicatively coupled with the first substrate of the first patch and the second substrate of the second patch. The bridge may be an embedded multi-die interconnect bridge (EMIB). The first and second substrates may be EMIBs and/or high-density packaging (HDP) substrates. The bridge may be positioned between two dies, and over an edge of the first patch and an edge of the second patch.
Bibliography:Application Number: TW20209103506