Ester compound, resin composition, cured product, and build-up film

• Main Authors: KUBO, AKIKO, SHINDO, MASAMI, TAKEDA, KOHEI, HAYASHI, TATSUSHI, KAWAHARA, YUKO
• Format: Patent
• Language: Chinese; English
• Published: 16.12.2020
• Subjects: ACYCLIC OR CARBOCYCLIC COMPOUNDS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

The purpose of the present invention is to provide an ester compound that can be used in a resin composition that has excellent heat resistance and dielectric properties after curing. Additionally, the purpose of the present invention is to provide: a resin composition containing the ester compound; a cured product of the resin composition; and a build-up film that is produced using the resin composition. The present invention is an ester compound having a phenylene ether oligomer structure in the main chain thereof, and having a polycyclic aromatic carbonyloxy group at both ends thereof.