Thermal curable adhesive film, sheet material for semiconductor process and semiconductor package manufacturing method wherein the thermal curable adhesive film is viscoelastic

• Main Authors: SATO, SATOSHI, TAKAMOTO, NAOHIDE, SHIGA, GOSHI
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

The present invention provides a thermal curable adhesive film suitable for temporarily fixing a plurality of semiconductor chips on a film in sequence to provide sufficient adhesion having relatively minor differences in adhesive force between chips, and suitable for suppressing a deviation of the chips when a chip array is being sealed, a sheet material for semiconductor process and a semiconductor package manufacturing method. The adhesive film 10 (i.e., the thermal curable adhesive film) of the present invention has a tensile storage modulus of 1 GPa at 20 degrees of Celsius and 0.1 MPa at 130 degrees of Celsius when a film specimen with a width of 10 mm is subjected to a dynamic viscoelasticity measurement under specific conditions. The sheet X for semiconductor process of the present invention includes a film 10 and a double-sided adhesive sheet material 20. The semiconductor package manufacturing method of the present invention includes a step of pressing and connecting the plurality of semiconductor c