Protection member for semiconductor, protection composition for inkjet coating-type semiconductor, and method for producing semiconductor apparatus using same, and semiconductor apparatus

• Main Authors: TOMITA, YUSUKE, YAMAMOTO, YUGO, YAMADA, YASUHARU, SHIRAISHI, TAKUMI
• Format: Patent
• Language: Chinese; English
• Published: 16.11.2020
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COLOUR PRINTING; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; CORRECTION OF TYPOGRAPHICAL ERRORS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; INKS; LINING MACHINES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PRINTING; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; SELECTIVE PRINTING MECHANISMS; SEMICONDUCTOR DEVICES; STAMPS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; TYPEWRITERS; USE OF MATERIALS THEREFOR; WOODSTAINS

The present invention addresses the problem of providing a protection member which is for a semiconductor and has excellent pattern retention at high temperatures and moisture resistance and has good adhesion to a semiconductor circuit, etc. for long period of time. The protection member which is for a semiconductor and solves said problem, includes a cured article of an organic polymerizable compound having a functional group containing an oxygen atom and/or a nitrogen atom. The absolute value of the difference between the linear expansion coefficient at 150 DEG C of the cured article and the linear expansion coefficient at 25 DEG C of the cured article is 55 or less.