Semiconductor back contact film and dicing tape integrated semiconductor back contact film suitable for suppressing warpage of a semiconductor wafer to which a semiconductor back contact film is attached

• Main Authors: SATO, SATOSHI, TAKAMOTO, NAOHIDE, SHIGA, GOSHI
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

This invention provides a semiconductor back contact film suitable for suppressing warpage of a semiconductor wafer to which a semiconductor back contact film is attached in a process of manufacturing a semiconductor device, and a dicing tape integrated semiconductor back contact film. In a film 10...