Semiconductor back contact film and dicing tape integrated semiconductor back contact film suitable for suppressing warpage of a semiconductor wafer to which a semiconductor back contact film is attached

• Main Authors: SATO, SATOSHI, TAKAMOTO, NAOHIDE, SHIGA, GOSHI
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

This invention provides a semiconductor back contact film suitable for suppressing warpage of a semiconductor wafer to which a semiconductor back contact film is attached in a process of manufacturing a semiconductor device, and a dicing tape integrated semiconductor back contact film. In a film 10 (semiconductor back contact film) of the present invention, a difference in exothermic value between the exothermic value in the range of 50 to 200 DEG in a differential scanning calorimetry at a heating rate of 10 DEG/min and the exothermic value in the range of 50 to 200 DEG in a differential scanning calorimetry at a heating rate of 10 DEG/min after two hours of thermal treatment at 130 DEG C is 50 J/g or less. The dicing tape integrated semiconductor back contact film X of the present invention includes a film 10 and a dicing tape 20. The dicing tape 20 has a laminated structure including a base material 21 and an adhesive layer 22. The film 10 is peelably adhered to the adhesive layer 22 of the dicing tape 20.