Wafer conversion device configured to place a first wafer carrier and a second wafer carrier

• Main Authors: SHIH, YING-RU, CHU, YUIH
• Format: Patent
• Language: Chinese; English
• Published: 16.09.2020
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; BASIC ELECTRIC ELEMENTS; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; STORING; TRANSPORTING

A wafer conversion device is configured to place a first wafer carrier and a second wafer carrier. The first wafer carrier includes a plurality of first accommodating grooves, and each of the first accommodating grooves is configured to accommodate a wafer. The second wafer carrier includes a plural...