Wafer conversion device configured to place a first wafer carrier and a second wafer carrier

• Main Authors: SHIH, YING-RU, CHU, YUIH
• Format: Patent
• Language: Chinese; English
• Published: 16.09.2020
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; BASIC ELECTRIC ELEMENTS; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; STORING; TRANSPORTING

A wafer conversion device is configured to place a first wafer carrier and a second wafer carrier. The first wafer carrier includes a plurality of first accommodating grooves, and each of the first accommodating grooves is configured to accommodate a wafer. The second wafer carrier includes a plurality of second accommodating grooves, and each of the second accommodating grooves is configured to accommodate a wafer and has a first groove portion and a second groove portion spaced apart from the first groove portion. The wafer conversion device includes a base, a guiding unit and a pushing mechanism. The guiding unit includes a first guiding frame with a plurality of first guiding grooves arranged vertically at intervals. The pushing mechanism can be controlled to push the wafers in the first accommodating grooves aligned with the second accommodating grooves, so that the wafers pass through the first guiding frame of the guiding unit via the first accommodating grooves and are finally moved to the second acco