Die bonding device and method of manufacturing semiconductor device

Provided is a die bonding apparatus capable of reducing vibration during the operation of a bonding head. The die bonding apparatus includes a bonding part and a control part. The bonding part includes a sensor for detecting the acceleration of the bonding head. The control part includes: an antipha...

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Bibliographic Details
Main Author TATE, MITSUAKI
Format Patent
LanguageChinese
English
Published 01.07.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided is a die bonding apparatus capable of reducing vibration during the operation of a bonding head. The die bonding apparatus includes a bonding part and a control part. The bonding part includes a sensor for detecting the acceleration of the bonding head. The control part includes: an antiphase addition waveform calculation part measuring vibration, occurring when the bonding head is operated in one of the X-axis, Y-axis, and Z-axis directions, by using the sensor, extracting vibration components in the X-axis, Y-axis, and Z-axis directions from the measured vibration waveform, and generating antiphase addition waveforms in the X-axis, Y-axis, and Z-axis directions for canceling the extracted vibration components; and a vibration suppression command waveform generation part generating a command waveform for vibration suppression by adding the antiphase addition waveforms in the X-axis, Y-axis, and Z-axis directions to command waveforms in the X-axis, Y-axis, and Z-axis directions.
Bibliography:Application Number: TW20198129073