Modified conductive structure and method for producing the same

A modified conductive structure is provided. The modified conductive structure includes a conductive substrate and a polymer film disposed over a surface of the polymer film. An interface between the polymer film and the conductive substrate includes a chemical bond. The polymer film includes repeat...

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Bibliographic Details
Main Authors CHANG, CHIH, LIN, HSINIEH, LAI, CHIN-PEN, CHENG, WANGIN
Format Patent
LanguageChinese
English
Published 16.05.2020
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
ELECTRICITY
INSULATORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Summary:A modified conductive structure is provided. The modified conductive structure includes a conductive substrate and a polymer film disposed over a surface of the polymer film. An interface between the polymer film and the conductive substrate includes a chemical bond. The polymer film includes repeating units as shown below: wherein, A is an antifouling molecular group; B is a sulfur-containing group or a nitrogen-containing group; R is a single bond or a first linking group; C is -L-E, wherein L is a second linking group, E is an enzyme unit; x and z are each independently 0 or an integer from 1 to 10000, and y is an integer from 1 to 10000; o is 0 or an integer from 1 to 50, and when o is an integer from 1 to 5, m and n are each independently 0 or an integer from 1 to 50.
Bibliography:Application Number: TW20198137840