Die bonding apparatus and manufacturing method of semiconductor device can easily perform confirmations of pickup property and collet mounting state

An objective of the invention is to provide a die bonding apparatus for automatically performing confirmations of pickup property and collet skewness. To achieve the object, the die bonding apparatus includes: a push-up unit that pushes up a die from below and peels off the die from a dicing tape; a...

Full description

Saved in:
Bibliographic Details
Main Authors OKAMOTO, NAOKI, NAKUI, YUKI, IKARASHI, ITSUKI
Format Patent
LanguageChinese
English
Published 16.04.2020
Subjects
BASIC ELECTRIC ELEMENTS
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
PACKING
PERFORMING OPERATIONS
PNEUMATIC TUBE CONVEYORS
SEMICONDUCTOR DEVICES
SHOP CONVEYOR SYSTEMS
STORING
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:An objective of the invention is to provide a die bonding apparatus for automatically performing confirmations of pickup property and collet skewness. To achieve the object, the die bonding apparatus includes: a push-up unit that pushes up a die from below and peels off the die from a dicing tape; and a die bonding part that sucks the peeled die and bonds the die onto a substrate. The push-up unit includes a push-up jig; and a housing mounted with the push-up jig. A measuring jig can be mounted in the housing and removed from the housing so as to replace the push-up jig. The push-up jig has a block for pushing up the dicing tape into a dome. The measuring jig stores a measuring machine in the dome.
Bibliography:Application Number: TW20198129074