Back surface adhesion film and dicing tape-combined back surface adhesion film

• Main Authors: SATO, SATOSHI, TAKAMOTO, NAOHIDE, SHIGA, GOSHI
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

An objective of the present invention is to provide a back-surface adhesion film appropriate for performing a chip test by infrared microscope observation from the back surface of a corresponding chip while attached to the back surface of a semiconductor chip while securing good infrared shield and laser marking properties. Also, the present invention provides a dicing tape-combined back surface adhesion film including the same. According to the present invention, a film (10), which is a back surface adhesion film, comprises a plurality of light absorption properties in which the absorption of each different wavelength in the ranges of visible and near infrared wavelengths is at its peak. The ratio value of the total light transmittance of a light with a wavelength of 1,000 nm measured with respect to a film sample piece with a thickness of 25 [mu]m prepared from the film (10) to the total light transmittance of a light with a wavelength of 1,800 nm measured with respect to the same sample piece is 1.2 or mor