Adhesive composition, laminate, and adhesive sheet

An adhesive composition containing (A) a bismaleimide resin represented by general formula (1), (B) an epoxy resin represented by general formula (2), and (C) a curing accelerator. [In formula (1), R1 represents a divalent hydrocarbon group derived from a dimer acid, Q represents a substituted or un...

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Bibliographic Details
Main Authors MASAKI, SHIRO, MIZUNO, MASATSUGU, SATO, KITARU, NAKAMURA, TAKESHI
Format Patent
LanguageChinese
English
Published 01.04.2020
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Summary:An adhesive composition containing (A) a bismaleimide resin represented by general formula (1), (B) an epoxy resin represented by general formula (2), and (C) a curing accelerator. [In formula (1), R1 represents a divalent hydrocarbon group derived from a dimer acid, Q represents a substituted or unsubstituted C1-100 aliphatic group, a substituted or unsubstituted aromatic group, or a substituted or unsubstituted heteroaromatic group, and n represents an integer of 0-100.] [In formula (2), R2 represents a hydrogen atom or a methyl group, and m represents an integer of 0-30.].
Bibliography:Application Number: TW20198123939