Benzoxazine compound, curable resin composition, adhesive, adhesive film, cured object, circuit board, interlayer dielectric material, and multilayered printed wiring board

• Main Authors: WAKIOKA, SAYAKA, TAKEDA, KOHEI, SHINDO, MASAMI, OATARI, YUTA, HAYASHI, TATSUSHI, KAWAHARA, YUKO
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

A purpose of the present invention is to provide a benzoxazine compound usable in a curable resin composition which has excellent pliability before curing and has excellent dielectric properties after curing. Another purpose of the present invention is to provide: a curable resin composition containing the benzoxazine compound; and an adhesive, adhesive film, cured object, circuit board, interlayer dielectric material, and multilayered printed wiring board each comprising or obtained using the curable resin composition. The benzoxazine compound of the present invention includes, in the molecule, both a benzoxazine ring and a diamine residue having a C4 or higher aliphatic skeleton and/or a triamine residue having a C4 or higher aliphatic skeleton.