Benzoxazine compound, curable resin composition, adhesive, adhesive film, cured object, circuit board, interlayer dielectric material, and multilayered printed wiring board
A purpose of the present invention is to provide a benzoxazine compound usable in a curable resin composition which has excellent pliability before curing and has excellent dielectric properties after curing. Another purpose of the present invention is to provide: a curable resin composition contain...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.04.2020
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Subjects | |
Online Access | Get full text |
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Summary: | A purpose of the present invention is to provide a benzoxazine compound usable in a curable resin composition which has excellent pliability before curing and has excellent dielectric properties after curing. Another purpose of the present invention is to provide: a curable resin composition containing the benzoxazine compound; and an adhesive, adhesive film, cured object, circuit board, interlayer dielectric material, and multilayered printed wiring board each comprising or obtained using the curable resin composition. The benzoxazine compound of the present invention includes, in the molecule, both a benzoxazine ring and a diamine residue having a C4 or higher aliphatic skeleton and/or a triamine residue having a C4 or higher aliphatic skeleton. |
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Bibliography: | Application Number: TW20198126332 |