Photosensitive resin composition for bump protective film, semiconductor device, method of producing semiconductor device and electronic device

A photosensitive resin composition for a bump protective film of the present invention includes a thermosetting resin, a photosensitive agent and solvent, wherein when a dry film with a thickness of 15 [mu]m obtained by applying the photosensitive resin composition on a silicon substrate and then dr...

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Bibliographic Details
Main Authors SUGIYAMA, HIROMICHI, SHIRAISHI, RYOTA, SUZUKI, SAKIKO
Format Patent
LanguageChinese
English
Published 16.01.2020
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Summary:A photosensitive resin composition for a bump protective film of the present invention includes a thermosetting resin, a photosensitive agent and solvent, wherein when a dry film with a thickness of 15 [mu]m obtained by applying the photosensitive resin composition on a silicon substrate and then drying the photosensitive resin composition is defined as a "photosensitive resin film", the photosensitive resin film on which a first process of exposing i-line, a second process of post-exposure heating, and a third process of spray development are sequentially performed is defined as a "post-development photosensitive film", and the post-development photosensitive film on which a fourth process of post-development heating is performed is defined as a "post-cure photosensitive film", pH1 of a first extraction liquid extracted from the post-development photosensitive film is 3.0 to 5.0, and pH2 of a second extraction liquid extracted from the post-cure photosensitive film is 0.1 to 1.0 higher than the pH1.
Bibliography:Application Number: TW20198113981