Sealing sheet and method of manufacturing electronic element device used to form a sealing layer for sealing an electronic element mounted on one surface in a thickness direction of a substrate

• Main Authors: HABU, TAKASHI, IINO, CHIE, SHIMIZU, YUUSAKU, OHARA, YASUMICHI
• Format: Patent
• Language: Chinese; English
• Published: 01.01.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A sealing sheet is used to form a sealing layer for sealing an electronic element mounted on one surface in a thickness direction of a substrate. The viscosity at 90 DEG C is 5 kPa or more. The maximum length L measured by the sealing test is 150 [mu]m or less. In the sealing test, a rectangular test element, 400 [mu]m in thickness and 10 mm in length, is arranged on one surface in the thickness direction of a glass test substrate in a first direction orthogonal to the thickness direction and a second direction orthogonal to the first direction and the thickness direction respectively. At 25 DEG C and 1330 Pa, the sealing sheet, 260 [mu]m in thickness and 20 mm in length in the first direction and the second direction respectively, is used to press and seal the test element at 2 MPa within 60 seconds in a manner of superimposing the test element in the thickness direction. After that, the sealing sheet is heated for one hour at 150 DEG C to form the sealing layer. A test gap is defined by the end face in at l